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Ground bounce arises from a dI/dt flowing through a common inductance in the return path.
Ground bounce is most problematic when several signals switch at the same time or when using high-speed drivers, both common with parallel data busses.
This new functionality allows designers to more easily limit the amount of ground bounce present immediately at the output of the FPGA and prevent corruption of the operation of other devices driven by the FPGA.
Chosen for "best" awards were papers in the fields of CAD, tools, and test; they deal, respectively, with digital ground bounce reduction by phase modulation of the clock; poor man's TBR--a simple model reduction scheme; and wrapper design for testintg IP cores with multiple clock domains.
When you consider all the different effects lumped under the term signal integrity, it seems like there is a neverending list of problems to keep track of: ground bounce, ringing, crosstalk, switching noise, rail collapse, delta I noise, capacitive coupling, reflections, discontinuities, impedance miss matches, lossy lines, terminations, branches, deterministic jitter, stubs, decoupling capacitors, loop inductance, via inductance, controlled impedance, time delay, skin depth, return current, layer transitions, differential impedance, collapse of the eye, common signal termination, differential signal termination, overshoot, intersymbol interference, ring back, etc.
The most common problem affecting stability of digital in-circuit tests is ground bounce between the device-under-test (DUT) and the test system.
The normal SCSI single ended interface has a signal return ground for each single line reducing ground bounce.
Rieper refereed an hour-long training ground bounce match on Saturday in which Larsson saw his first action since suffering a horrific leg break in Lyon last October.
The DEIC421 incorporates Kelvin connections to the driver input and ground pins directly to the IC chip, allowing the use of a common mode choke to prevent unwanted turn-on or turn-off of the driver from ground bounce.
For larger devices that exceed the available number of test-head resources (for example, testing a 300-pin ASIC when only 200 resources are available), or to minimize ground bounce caused by too many simultaneous transitions, automatically split the connect test into two or more smaller tests.
Both 2-port and 4-port instruments will be used in the workshop to illustrate how to measure transmission lines and discontinuities, ground bounce, the low impedance of the power distribution network and differential S-Parameters.