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Both chip packages are RoHS compliant and support an operating temperature range of -40xC to 85xC.
XinTec Wafer Level CSP is a mainstream wafer level packaging technique, offering key advantages over conventional chip packages such as miniaturized and reliable design, increased functionality and board capacity, lower cost and enhanced quality for applications in cellular phones, PDAs, still cameras and other electronic devices.
In the past twelve months, Amkor has delivered over 10 million flip chip packages containing 90nm Common Platform silicon from multiple foundries for the gaming market.