Via

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VIA. A cart-way, which also includes a foot-way and a horse-way. Vide Way.

References in periodicals archive ?

The following parasitic functions can be obtained, where [R.sub.v] is self-resistance of the TSV, [C.sub.v] is the capacitance of the isolated TSV, [L.sub.v] is the inductance of the isolated TSV, [C.sub.s] is the self-capacitance of the TSV, [C.sub.c] is TSV-to-TSV coupling capacitance, and [L.sub.m] is the mutual inductance between two TSVs.

High-Level Crosstalk Model in N-Coupled Through-Silicon Vias (TSVs)

Toshiba Memory Corporation will commercialise BiCS Flash with TSV technology to provide an ideal solution in respect for storage applications requiring low latency, high bandwidth and high IOPS /watt, including high-end enterprise SSDs, it stated.

Toshiba develops first 3D flash memory with TSV techology

Finally, the additional purchase price of USD32.5m will be paid at closing, which will be seller financing in the form of a note to TSV from the buyer, secured by a Deed of Trust on the property and bearing an annual interest at 0.75%.

Owens Realty signs purchase agreement for land and entitlements for USD42.5m

Avoiding relegation TSV avoided relegation to the third-tier of the Bundesliga in dramatic style.

It's 1860 time for Swans, but who'll they be facing?

In order to better understand wave propagation in TSV structures, a numerical model has been developed using explicit time domain, finite element modeling (FEM) and the PZFlex code (Weidlinger Associates, Mountain View, Calif.).

Laser-based ultrasonics: laser-based ultrasonics provides a high-sensitivity, non-contact technique for non-destructive evaluation of materials

HBM, consisting of stacked DRAM die, built with Wide I/O and TSV, supports 128GB/s to 256Gbp bandwidths.

3D layer stacking, TSV to replace DDR, report says

(NASDAQ: LRCX), a major global supplier of innovative wafer fabrication equipment and services to the semiconductor industry, today announced it has shipped the 100th Syndion(R) module for deep silicon etch applications, including CMOS image sensors (CIS), interposers, and through-silicon vias (TSVs).

Lam Research Ships 100th Syndion(R) Etch Module

Gaia quit TSV and started at Thornes Park last September.

Gaia grabs gold after elbowing injury woe

Such an angle [theta], in combination with two different p/d ratios, are used in later SE TSV examples to correlate between theory and experiment.

COMPARATIVE MODELING OF SINGLE-ENDED THROUGH-SILICON VIAS IN GS AND GSG CONFIGURATIONS UP TO V-BAND FREQUENCIES

The TSV Pfungstadt club has proud fistball tradition.

Windhoek hosts world Fistball championship for the fifth time

Combining our advanced silicone expertise with SUSS MicroTec's knowledgeable leadership in processing equipment, we were able to develop a temporary bonding solution that met all critical performance criteria for TSV fabrication processes.

Dow Corning and SUSS MicroTec Report New Temporary Bonding Solution for 2.5D and 3D IC Packaging at ECTC 2013

"Scalable 3D-FPGA Using Wafer-to-Wafer TSV Interconnect of 15 Tbps/W, 3.3 Tbps/[mm.sup.2]"