Via

(redirected from TSV)
Also found in: Dictionary, Thesaurus, Medical, Acronyms, Encyclopedia, Wikipedia.

VIA. A cart-way, which also includes a foot-way and a horse-way. Vide Way.

References in periodicals archive ?
The following parasitic functions can be obtained, where [R.sub.v] is self-resistance of the TSV, [C.sub.v] is the capacitance of the isolated TSV, [L.sub.v] is the inductance of the isolated TSV, [C.sub.s] is the self-capacitance of the TSV, [C.sub.c] is TSV-to-TSV coupling capacitance, and [L.sub.m] is the mutual inductance between two TSVs.
Toshiba Memory Corporation will commercialise BiCS Flash with TSV technology to provide an ideal solution in respect for storage applications requiring low latency, high bandwidth and high IOPS /watt, including high-end enterprise SSDs, it stated.
Finally, the additional purchase price of USD32.5m will be paid at closing, which will be seller financing in the form of a note to TSV from the buyer, secured by a Deed of Trust on the property and bearing an annual interest at 0.75%.
Avoiding relegation TSV avoided relegation to the third-tier of the Bundesliga in dramatic style.
In order to better understand wave propagation in TSV structures, a numerical model has been developed using explicit time domain, finite element modeling (FEM) and the PZFlex code (Weidlinger Associates, Mountain View, Calif.).
HBM, consisting of stacked DRAM die, built with Wide I/O and TSV, supports 128GB/s to 256Gbp bandwidths.
(NASDAQ: LRCX), a major global supplier of innovative wafer fabrication equipment and services to the semiconductor industry, today announced it has shipped the 100th Syndion(R) module for deep silicon etch applications, including CMOS image sensors (CIS), interposers, and through-silicon vias (TSVs).
Gaia quit TSV and started at Thornes Park last September.
Such an angle [theta], in combination with two different p/d ratios, are used in later SE TSV examples to correlate between theory and experiment.
The TSV Pfungstadt club has proud fistball tradition.
Combining our advanced silicone expertise with SUSS MicroTec's knowledgeable leadership in processing equipment, we were able to develop a temporary bonding solution that met all critical performance criteria for TSV fabrication processes.
"Scalable 3D-FPGA Using Wafer-to-Wafer TSV Interconnect of 15 Tbps/W, 3.3 Tbps/[mm.sup.2]"