Via

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VIA. A cart-way, which also includes a foot-way and a horse-way. Vide Way.

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The second step in designing a transparent via is to recognize that, in general, vias tend to be low impedance, so do what you can that is free to raise the impedance of the vias.
The 6 habits of transparent via design: via performance depends more on stub length than on effective characteristic impedance
The optimal method is to have the board shop fill and plate over the vias. Most fab shops have thermally conductive fill materials that transfer heat almost as well as the open via.
Via in paste: don't design vias to be filled with paste; tent or fill the holes before assembly
The differential impedance of the vias will be between the impedance given by the twin rods and the rods with coupling to the planes, depending on the size of the anti-pads.
Practical design of differential vias: suggestions for optimizing vias using circuit modeling
FIGURE 2 is a closeup of a through via with solder mask filling the via and solder paste printed with a segmented pattern, covering approximately 40 to 50% of the center pad.
Soldering With and WithoutThrough Vias: Imaged solder mask is preferred to filled vias to reduce voids and volatiles
A paper presented at last year's EMC Symposium considered the signal imbalance that ground-return via placement has on nearby differential pairs of vias.
Maintaining high-speed signal integrity
In these cases, the use of blind vias and buried vias completely eliminates the through-hole via stub, improving the signal integrity of the PCB.
Improving signal integrity with microvias blind, buried or smaller-sized holes can reduce plane voids and insertion loss
Smaller via sizes, which created smaller voids than larger vias.
Microvia-in-pad: possible outcomes and solutions; The features that enable portable technology can cause assembly process predicaments
Plated through-hole (PTH) via structures in high layer count printed circuit boards and thick backplanes/midplanes can significantly distort high-speed digital signals that pass through them.
Manufacturing techniques to decrease high-speed Digital Signal distortion: backdrilling is a cost effective strategy to reduce detrimental signal distortions cased by PTH via stub structures
One such discontinuity that is common in multilayered printed circuit boards is the via. The accurate characterization of a printed circuit board via is an important issue in the successful design of high speed circuits implemented on multilayered printed circuit boards.
TIME DOMAIN ANALYSIS OF A PRINTED CIRCUIT BOARD VIA
Two amps through the 20 mil trace results in a 37.5[degrees] to 38[degrees]C temperature in both the trace and via. As trace width increases, the trace can carry more current.
More on VIA TEMPERATURES: Can vias carry considerably more current than was previously known?
Our recommended method is to plug the via with copper or epoxy and have it plated over by the fabricator.
Super small via-in-pad: no matter the size, they should always be closed
Conductive fill, especially for packaging applications where vias are small (50 to 75 [micro]m in size), is often completed using an electrolytic copper plating technique.
Endicott Interconnect: filling the gap: an investigation of blind and thru via fill techniques for semiconductor package and printed circuit board applications

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