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In general, micromechanical properties are often observed due to the development of dislocations, slip bands, and dislocation substructures when the materials accumulate fatigue damage.
The cracking appears to form a "slip band" effect, or standard solder fatigue cracking, due to the -40[degrees] to 125[degrees]C thermal exposure.
Graduated compression elastic medium 30-40 large mmhg, to the thigh with slip band clamp at the end
Although, in this example, only a small deformation case is considered, the slip bands can still be observed.