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Some of these "magic" ingredients are corrosive, which is why they are so effective, but this also means they need to be used in a manner that will prevent the tip tinner corrosive materials from remaining on the tip (FIGURE 9) or creating cross-contamination of the product being soldered.
5Ag solder, soldered with the flux, a finer morphology of the new-formed phase was revealed, whereas in case of joint fabricated with Sn6Ag4TiCe solder without flux, a coarse morphology was observed, see Fig.
Generally, x-ray images of lead-free soldered joints are similar to SnPb, although grayscales may be slightly different for SAC solder because of the absence of lead.
These are electronic parts that are made to be inserted or soldered in the through-hole of PWBs.
Expensive robotics position the board and fixture over the fountain/wave for a preset dwell time, after fluxing and preheating, and the PCB is soldered all at once.
The target was soldered by application of Cr/Ni/Ag system of layers and really tested in practice.
The solderpot temperature setting depends on the type of solder, but also may be related to the product to be soldered (i.
The selective aperture fixture effectively masks the areas previously soldered in the SMT reflow and non-selective wave soldering process, while exposing only those areas to be selectively soldered.
A typical wave soldering machine operates at 245[degrees] to 260[degrees]C, whereas in selective soldering, the solder temperature is closer to 300[degrees]C for a variety of reasons that include the smaller area and heat-dissipative characteristics of the board, the type of component soldered, the need for through-hole filling, and others.
If the solder does not cover the pad on the topside of the board and has not traveled to the top of the plated through-hole, then the joint is incompletely soldered.
With the introduction of lead-free requirements, process engineers must now also consider the ability to achieve the heat required to reflow the lead free solder paste and to cool the soldered joints at a rate that will provide the best possible product quality.
These units raise board temperature while the previously heated board is being fluxed and soldered in the selective machine.