via

(redirected from through-silicon via)
Also found in: Dictionary, Thesaurus, Medical, Encyclopedia.
See: course, direction, facility, instrumentality, method, mode, through

VIA. A cart-way, which also includes a foot-way and a horse-way. Vide Way.

References in periodicals archive ?
By joining SEMATECH's 3D Interconnect program and collaborating with industry-leading partners, we expect to play a critical role in addressing industry infrastructure and technology gaps in equipment, integration and product related issues for high volume adoption of through-silicon vias.
In addition, DBI[R] offers the highest available interconnect density and alignment accuracy, and is fully compatible with damascene interconnect processing, opening new avenues for foundry-based through-silicon via process flows.
According to a new market research report " Three-dimensional Integrated Circuit (3D IC/Chip) & Through-Silicon Via (TSV) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016) By Technology (Substrate, Bonding Techniques, Process Realization, Fabrication), Products (Memory, LED, Sensor, MEMS, Power & Analog Components) & Applications (Mobile Devices, Processors, ICT, Networking, Automotive, Defense) " published by MarketsandMarkets (http://www.
HSINCHU, Taiwan -- SEMATECH experts reported on innovative approaches to realize advanced CMOS logic and memory device technologies and 3D through-silicon via (TSV) manufacturing at the International VLSI Technology, System and Applications Symposium (VLSI-TSA) on April 23-25, 2012.
Thanks to its multisensor capability, the tool can be extended with additional sensors based on reflectometry, interferometry, confocal microscopy and atomic force microscopy, enabling it to reliably perform complicated inspection tasks such as through-silicon via measurements (TSV) at ultra high aspect-ratios of up to 1:100.
com/research/6048d63d/threedimensional) has announced the addition of the "Three-Dimensional Integrated Circuit (3D Ic/Chip) & Through-Silicon Via (Tsv) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016) By Technology (Substrate, Bonding Techniques, Process Realization, Fabrication), Products (Memory, Led)" report to their offering.
It also is offering cleaning solutions that address all types of packaging including gold and copper wire bonding, wafer level packaging with copper bumps and through-silicon via cleans.
These include temporary bonding to handle wafers, wafer thinning, through-silicon via (TSV) reveal, re-distribution layers (RDL), wafer or die bonding, and wafer release.