Via
(redirected from through-silicon via)Also found in: Dictionary, Thesaurus, Medical, Encyclopedia.
VIA. A cart-way, which also includes a foot-way and a horse-way. Vide Way.
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References in periodicals archive
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Horng, "Comparative modeling study of single-ended through-silicon via between the G-S and G-S-G configuration," IEEE Int.
Xu, "Frequency and temperature-dependent modeling of coaxial through-silicon via for 3-D ICs," IEEE Trans.
The first technology is a post through-silicon via technology capable of 140 [micro]m pitch.
They will leverage through-silicon via (TSV) and through-mold via in integrated, mixed technologies in single packages, as well as chip-on-chip (CoC) and chip-on-interposer over the next five years.
3D-IC integration uses through-silicon via (TSV) technology, an emerging interconnection technology that will replace the traditional wire-bonding process in chip/wafer stacking.
Potential future collaborations include those in the fields of through-silicon via (TSV) and advanced packaging, 3-dimensional integrated chips, photonics and nanoelectronics.
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